Join us at the EPIC TechWatch at CIOE to explore the future of optics. This EPIC event brings together experts and leaders from the optics industry, showcasing groundbreaking technologies. Participate to learn more optics and photonics companies specialized in various aspects of this field, including the development and manufacturing of diode laser systems, photonic devices, optical filters, thin-film coatings, high-precision 3D printers for microfabrication, nanofabrication solutions, advanced materials for vacuum and photonic applications, and die bonding and dispensing solutions for photonic applications. These companies along the manufacturing value chain contribute to advancing photonic and optical technologies, playing crucial roles in the innovation and application of these technologies across multiple sectors.
Presentations will be held in Chinese language.
Moderators:
14:00 – 14:05 Welcoming by the moderators
14:05 – 16:55 Speakers Presentations:
14:05 – 14:13 Richard Dong, AMO China Sales VP, Advanced Micro-optics Technologies – AMO Wafer Stacking Technology
14:13 – 14:21 Chuanqi Ren, Product Manager, BWT – The “laser” the better our life
14:22 – 14:30 Pan Li, Regional Sales Manager, DELO – Adhesives for Silicon Photonics / Photonic Integrated Circuits (PIC)
14:30 – 14:38 Corrine Lee, Engineering Manager, Edmund Optics – In China for China: Edmund Optics’ Global Footprint and Localization Strategy
14:38 – 14:46 Beibei Wu, Senior Engineer, ETSC Technologies – Test Design Kit (TDK) for General Wafer Level Testing of Photonic Devices
14:46 – 14:55 Sun Xuerui, Application Engineer Manager – Great China, Korea&Japan, EXFO – PIC Wafer Level Test Requirements, Methods, and Challenges
14:55 – 15:04 Alex Cao, General Manager, ficonTEC Service Shanghai – ficonTEC Cutting Edge Technology of SiP Testing and Assembly for Now and Future
15:04 – 15:13 Hsiang-Chu Wang, Photonics System Engineer and Optical Designer, Focuslight Technologies – Transformative Diffractive Optics: Flat Lenses for Telecom and Pan-Semiconductor Applications
15:13 – 15:21 Xiaolun Zeng, Product Group Manager, Iridian Spectral Technologies – Multi-Functional Optical Filters for New-Gen Telecom Networks
15:21 – 15:30 Can Yao, Application Engineer, LIGENTEC – Low loss Photonic Integrated Circuits (PICs): From Prototyping to Volume
15:30 – 15:38 Limin Zhou, General Manager, MRSI Automation – AI-Driven Innovation in Optoelectrical Packaging
15:38 – 15:46 Wanyin Cui, General Manager, Nanoscribe China – Recent Advances in Aligned Two-Photon Grayscale Lithography
15:46 – 15:55 Martin Balimann, Head of Engineering and Head of Swiss Office, NIL Technology – Metaoptics produced by Nanoimprint Lithography and Dry Etching
15:55 – 16:03 Xianghua Meng, General Manager, SAES Getters – Getter Technologies for Electronics and Optoelectronics Hermetic Packaging
16:03 – 16:12 Lukas Liu, Technical Application Manager Advanced Optics Asia, SCHOTT – High Brightness Phosphor Ceramics for Laser Projection
16:12 – 16:21 Oliver Chen, Industry market Sales, TOPTICA Photonics China – All wavelengths Toptica
16:21 – 16:30 Kevin Lu, Sales & marketing director APAC, TRUMPF (China) – 980nm VCSEL & PD for automotive data communication
16:30 – 16:39 Dikai Niu, Optical design Engineer, Umicore – Progress in optics for cost effective thermal imaging solutions
16:39 – 16:47 Zewang You, Team Lead of Materials and Core Processes, Vanguard Automation – Next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding (PWB) and Facet-Attached Micro-Optical Elements
16:47 – 16:55 Li Linfeng, General Manager of Nanjing Wavelength Laser Division, Wavelength Opto-Electronic – Advanced Laser Optics Development in Wavelength OE
16:56 – 17:00 Closing remarks by the moderators
Shenzhen World Exhibition & Convention Center (address: No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, Guangdong, China), Hall 3 (OPTICS) Presentation Forum.
For more information about the venue and how to reach it, please read HERE.
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