4-5 June 2024
EPIC Technology Meeting on Photonic Integration and Packaging at Fraunhofer IZM
Berlin, Germany

Hosted by

EPIC Meeting on Integrated Photonics at Fraunhofer IZM, a groundbreaking event that brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology and scalable packaging of photonic chips. As the demand for faster, smaller, and more efficient electronic devices continues to surge, integrated photonics has emerged as a transformative technology. It offers a myriad of opportunities to revolutionize various sectors, including telecommunications, data centers, healthcare, and sensing applications. Fraunhofer IZM, renowned for its pioneering research in microsystems and packaging technology, is at the forefront of advancing integrated photonics, enabling innovative solutions with unparalleled performance and reliability. The EPIC Meeting serves as a nexus where industry pioneers, entrepreneurs, investors, researchers, and decision-makers can converge to exchange knowledge, share experiences, and collaborate on the future prospects of integrated photonics. With an emphasis on scalable packaging of photonic chips, participants will delve into cutting-edge advancements in chip-scale integration, heterogeneous integration, advanced packaging techniques, and novel manufacturing processes.


3 June 2024, Monday

Company visits: the group is fully booked, check your registration HERE. Please inform Vera if you won’t be able to join.

09:10 Gather at MOXY BERLIN HUMBOLDTHAIN PARK (address: Hochstraße 2, 13357 Berlin)
09:15-10:00 Drive
10:00-11:30 Fraunhofer HHI (address: Einsteinufer 37, 10587 Berlin, Germany)
11:30-12:15 Drive
12:15-13:30 Sicoya ((address: Carl-Scheele-Straße 16, 12489 Berlin, Germany)
13:30-14:30 Lunch
14:30-16:00 AEMTEC (address: James-Franck-Straße 10, 12489 Berlin, Germany)

18:30 – 21:30 Optional pre-event dinner @Restaurant MOXY (address: Humboldthain Park, Hochstraße 2-3, D-13357 Berlin)

4 June 2024, Tuesday

12:00 – 13:10 – Registration and lunch @Fraunhofer IZM

Welcoming words:
13:10 – 13:15 EPIC – Welcoming words – Ivan Nikitzki, Technology Expert
13:15 – 13:30 Fraunhofer IZMWelcome and Introduction of Fraunhofer IZM – Rolf Aschenbrenner, Head of Department (Germany)

13:30 – 15:30 SESSION 1: Integrated Photonics in Volume

  • KEYNOTE – NVIDIA – Liron Gantz, Manager of the Electro-Optics Group (Israel)
  • X-FAB – Joni Mellin, Product Marketing Manager Photonics (Germany)
  • TESATOptical Network Products for Space – Opportunities for PICs – Hanno Scheife, Team Leader (Germany)
  • EV GroupThe Impact of Nanoimprint Lithography on PIC Manufacturing for Sensing and Datacom – Thomas Achleitner, Business Development Manager (Austria)
  • Yole Group – Martin Vallo, Senior Analyst (France)

15:30 – 16:15 Networking coffee break

16:15 – 18:15 SESSION 2: Advanced Packaging

  • KEYNOTE – Fraunhofer IZMPhotonic System-in-Package (pSiP) by Applying Thin Glass – Henning Schröder, Group Manager (Germany)
  • TOPTICA EAGLEYARDPackaging Challenges of Single Frequency High-power Lasers for Visible and NIR – Björn Globisch, Head of R&D (Germany)
  • Fraunhofer HHIHybrid Photonic Integration for High-End Optical Transceivers – David de Felipe Mesquida, Senior Project Manager (Germany)
  • VTTIntegration of III-V Components on VTT’s 3µm SOI Platform – Jae-Wung Lee, Research Scientist (Finland)
  • PhotonFirst – Elvis Wan, Senior Industrialisation Engineer (The Netherlands)
  • NanoscribeTowards Scalable Aligned Two Photon Lithography for Photonic Integration – Jörg Smolenski, Business Development Manager (Germany)
  • HETEROMERGEFunctional Two-photon 3D Printing of Micro-optics Using in Situ Print Material Exchange – Robert Kirchner, CEO & Co-Founder (Germany)

18:30 – 22:00 Networking Dinner @Cantinerie (address: Gustav-Meyer-Allee 25, 13355 Berlin)

5 June 2024, Wednesday

08:00 Departure from the recommended hotel
08:15 – 08:40 Morning coffee @ Fraunhofer IZM
08:40 – 08:45 Recap by EPIC

08:45 – 10:30 SESSION 3: Photonics Packaging in Volume

  • KEYNOTE – PHIXPIC Packaging Scale up Challenges – Jeroen Duis, Chief Commercial Officer (The Netherlands)
  • ICON Photonics Low-loss Optical Coupling of PIC with Ultra-compact Fiber-array-units – Jean-Luc Polleux, Co-founder and CTO (France)
  • Vanguard Automation – Thorsten Mayer, CEO (Germany)
  • AEMtecHigh Accuracy Placement – Passive Versus Active Alignment, Benefits and Challenges – Daniel Lieske, Senior Expert Advanced Packaging (Germany)
  • Albis OptoelectronicsTest Strategies for Mass Transfer Photodiodes – Hektor Meier, Head of Product Development (Switzerland)
  • Heidelberg InstrumentsMaskless Lithography and Two-Photon Polymerization for Photonics Integration and Packaging: Exploring Various Cases – Steffen Diez, Chief Operations Officer (Germany)

10:30 – 11:15 Networking coffee break

11:15 – 12:45 SESSION 4: Reliability and Testing

  • KEYNOTE – ficonTEC – Moritz Seyfried, Director Research & Development (Germany)
  • Silicon Austria LabsValidation Lab @SAL for Photonic Packaging Ageing Evaluation – Rudolf Heer, Head of Research Unit Electronic Sensors (ELS) (Austria)
  • AIXEMTEC – Sebastian Haag, CEO (Germany)
  • EtteplanRepeatability and Flexibility in Packaging – Niels Jansen, Engineering Manager (The Netherlands)
  • VLC Photonics – Joan Felip, Automation Manager (Spain)
  • EXFOUnlocking Efficiency: Strategies for Enhanced PIC Testing Performance – Sophie Lange, Application Engineer (Germany)

12:45 – 14:00 Networking Lunch

14:00 – 15:30 Lab-Tours at Fraunhofer IZM, including Demo by Vanguard Automation

Busses to BER Airport won’t be organized, we advise instead to take the express trains from Gesundbrunnen (10mins walking distance) to BER or Berlin Central Station


We recommend to book your room at the MOXY BERLIN HUMBOLDTHAIN PARK (address: Hochstraße 2, 13357 Berlin) directly on their website or or any other hotel nearby.

If you arrive with your own car, we recommend to use this parking.


Company Visits on 3rd June

Fraunhofer Heinrich Hertz Institute does research on communications since more than 90 years. Nowadays, about every second bit transported in the internet touches HHI InP technology on its way to the receiver. With a strong focus on InP, we also develop polymer waveguide based hybrid integration and SiNx photonics. While our expertise is strongest in high performance (100 GBit/sec and above) data- and telecom, we have strongly increasing activities in communication and sensor systems, e.g. based on Terahertz and LiFi technology. We regularly offer multi-project wafers in InP. Our partners have the choice to do the design themselves and just use us as a foundry or to get both design and chips from a single source.

Sicoya a spin off from TU Berlin, is developing silicon photonics (SiPh) based photonic integrated circuits (PICs) for optical data center interconnects using a fabless business model. The founding team raised 4.9 M€ of nonrepayable public funds for R&D in the last 8 years. Sicoya aims to enter the market with a 4×25 Gbit/s sealed and packaged transceiver chip for intra data center connections with link distances up to 2 km. Sicoya designs, packages and sells silicon photonic based Application Specific Photonic Integrated Circuits (ASPICs). Our technology enables the production of highly integrated optical transceivers at very low manufacturing costs.

AEMtec is a global acting specialist for the development and production of customized and reliable micro- and optoelectronics. In the sector of miniaturization AEMtec provides a wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto Packaging; all realized in cleanroom environment (ISO class 5 to 8). From concept to serial production including design and development, process management and industrialization the customers benefit from the services by a single source provider. AEMtec is certified by official organizations: ISO 9001, ISO 13485 (Medical) and ISO 14001 (Environment).

Head of Department at Fraunhofer IZM
Senior Industrialisation Engineer at PhotonFirst
Head of Research Unit Electronic Sensors (ELS) at Silicon Austria Labs
Team Leader at TESAT
Director Research & Development at ficonTEC
Co-Founder and CTO at ICON Photonics
Business Development Manager at Nanoscribe
Senior Project Manager at Fraunhofer HHI
Product Marketing Manager Photonics at X-FAB
Engineering Manager at Etteplan
Business Development Manager at EV Group
Chief Operations Officer at Heidelberg Instruments
Senior Expert Advanced Packaging at AEMtec

Dr. Hektor Meier obtained his PhD from the Swiss Federal Institute of Technology (ETH) in 2011. Shortly after he became a member of the product development team of Enablence Switzerland and later Albis Optoelectronics. He was responsible for the development of ultra high speed InGaAs PIN and avalanche photodiodes. Since 2016 he acts as Head of Product Development at Albis and is in charge of the technology development and expansion of the product portfolio.

Head of Product Development at Albis Optoelectronics
Senior Analyst at Yole Group
Research Scientist at VTT
Manager of the Electro-Optics Group at NVIDIA
Chief Commercial Officer at PHIX
Automation Manager at VLC Photonics
Business Development Engineer at EXFO
Head of R&D, Head of Frontend at TOPTICA EAGLEYARD

More attendees will be announced soon.

Supported By
Useful resources
Technology Manager
Technology scope and agenda
Ivan Nikitski, PhD
Ivan Nikitski, PhD
Technology Expert for Quantum and Integrated Photonics
Programme Manager
Lídia Briquets
Lídia Briquets
Programme Manager
Event Manager
Logistics, venue, accommodation, and transportation
Vera Koniukhova
Vera Koniukhova
Events Manager
Media Partner/s
Market Reports

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