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4-5 June 2024
EPIC Technology Meeting on Photonic Integration and Packaging at Fraunhofer IZM
Berlin, Germany

Hosted by
EPIC Members
350.00 Excl. VAT
Invited companies
350.00 Excl. VAT
Non-members
550.00 Excl. VAT


EPIC Meeting on Integrated Photonics at Fraunhofer IZM, a groundbreaking event that brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology and scalable packaging of photonic chips. As the demand for faster, smaller, and more efficient electronic devices continues to surge, integrated photonics has emerged as a transformative technology. It offers a myriad of opportunities to revolutionize various sectors, including telecommunications, data centers, healthcare, and sensing applications. Fraunhofer IZM, renowned for its pioneering research in microsystems and packaging technology, is at the forefront of advancing integrated photonics, enabling innovative solutions with unparalleled performance and reliability. The EPIC Meeting serves as a nexus where industry pioneers, entrepreneurs, investors, researchers, and decision-makers can converge to exchange knowledge, share experiences, and collaborate on the future prospects of integrated photonics. With an emphasis on scalable packaging of photonic chips, participants will delve into cutting-edge advancements in chip-scale integration, heterogeneous integration, advanced packaging techniques, and novel manufacturing processes.

Agenda

3 June 2024, Monday

Company visits (Separate registration needed)

Companies to visit: TBA

18:30 – 21:30 Optional pre-event dinner @Restaurant MOXY (address: Humboldthain Park, Hochstraße 2-3, D-13357 Berlin)

4 June 2024, Tuesday

13:30 – 15:30 SESSION 1: Integrated Photonics in Volume

  • X-FAB – Joni Mellin, Product Marketing Manager Photonics (Germany)
  • Fraunhofer HHIHybrid Photonic Integration for High-End Optical Transceivers – David de Felipe Mesquida, Senior Project Manager (Germany)
  • Ligentec – Michael Geiselmann, CCO (Switzerland)
  • TESAT – Hanno Scheife, Team Leader (Germany)
  • EV Group – Thomas Achleitner, Business Development Manager (Austria)
  • Yole Group – Martin Vallo, Senior Analyst (France)

15:30 – 16:15 Networking coffee break

16:15 – 18:15 SESSION 2: Advanced Packaging

  • KEYNOTE – Fraunhofer IZMPhotonic System-in-Package (pSiP) by Applying Thin Glass – Henning Schröder, Group Manager (Germany)
  • Nanoscribe – Martin Hermatschweiler, CEO (Germany)
  • HETEROMERGEFunctional Two-photon 3D Printing of Micro-optics Using in Situ Print Material Exchange – Robert Kirchner, CEO & Co-Founder (Germany)
  • PhotonFirst – Elvis Wan, Senior Industrialisation Engineer (The Netherlands)
  • Heidelberg InstrumentsMaskless Lithography and Two-Photon Polymerization for Photonics Integration and Packaging: Exploring Various Cases – Steffen Diez, Chief Operations Officer (Germany)
  • VTT – Jae-Wung Lee, Research Scientist (Finland)

5 June 2024, Wednesday

08:45 – 10:30 SESSION 3: Photonics Packaging in Volume

  • NVIDIA – Liron Gantz, Manager of the Electro-Optics Group (Israel)
  • KEYNOTE – PHIXPIC Packaging Scale up Challenges – Jeroen Duis, Chief Commercial Officer (The Netherlands)
  • ICON Photonics Low-loss Optical Coupling of PIC with Ultra-compact Fiber-array-units – Jean-Luc Polleux, Co-founder and CTO (France)
  • Vanguard Automation – Philipp Dietrich, Co-Founder (Germany)
  • AEMtec – Daniel Lieske, Senior Expert Advanced Packaging (Germany)
  • More speakers will be announced soon

10:30 – 11:15 Networking coffee break

11:15 – 12:45 SESSION 4: Reliability and Testing

  • Silicon Austria Labs – Rudolf Heer, Head of Research Unit Electronic Sensors (ELS) (Austria)
  • ficonTEC – Moritz Seyfried, Director Research & Development (Germany)
  • AIXEMTEC – Sebastian Haag, CEO (Germany)
  • Etteplan – Niels Jansen, Engineering Manager (The Netherlands)
  • Albis Optoelectronics – Hektor Meier, Head of Product Development (Switzerland)
  • VLC Photonics – Joan Felip, Automation Manager (Spain)
Accommodation

We recommend to book your room at the MOXY BERLIN HUMBOLDTHAIN PARK (address: Hochstraße 2, 13357 Berlin) directly on their website or booking.com or any other hotel nearby.

 

Company Visits on 3rd June

Fraunhofer Heinrich Hertz Institute does research on communications since more than 90 years. Nowadays, about every second bit transported in the internet touches HHI InP technology on its way to the receiver. With a strong focus on InP, we also develop polymer waveguide based hybrid integration and SiNx photonics. While our expertise is strongest in high performance (100 GBit/sec and above) data- and telecom, we have strongly increasing activities in communication and sensor systems, e.g. based on Terahertz and LiFi technology. We regularly offer multi-project wafers in InP. Our partners have the choice to do the design themselves and just use us as a foundry or to get both design and chips from a single source.

More companies will be announced

Speakers
Senior Industrialisation Engineer at PhotonFirst
Head of Research Unit Electronic Sensors (ELS) at Silicon Austria Labs
Team Leader at TESAT
Director Research & Development at ficonTEC
CEO & Co-Founder at HETEROMERGE
Co-Founder and CTO at ICON Photonics
Senior Project Manager at Fraunhofer HHI
Product Marketing Manager Photonics at X-FAB
Engineering Manager at Etteplan
Business Development Manager at EV Group
Chief Operations Officer at Heidelberg Instruments
Daniel Lieske
Senior Expert Advanced Packaging at AEMtec

Dr. Hektor Meier obtained his PhD from the Swiss Federal Institute of Technology (ETH) in 2011. Shortly after he became a member of the product development team of Enablence Switzerland and later Albis Optoelectronics. He was responsible for the development of ultra high speed InGaAs PIN and avalanche photodiodes. Since 2016 he acts as Head of Product Development at Albis and is in charge of the technology development and expansion of the product portfolio.

Head of Product Development at Albis Optoelectronics
Senior Analyst at Yole Group
Research Scientist at VTT
Manager of the Electro-Optics Group at NVIDIA
Chief Commercial Officer at PHIX
Automation Manager at VLC Photonics


More speakers will be announced soon.

Attendees

More attendees will be announced soon.

Sponsors
Gold
Bronze
Supported By
Useful resources
Technology Manager
Technology scope and agenda
Ivan Nikitski, PhD
Ivan Nikitski, PhD
Technology Manager for Quantum and Integrated Photonics
Programme Manager
Coordination
Lídia Briquets
Lídia Briquets
Programme Manager
Event Manager
Logistics, venue, accommodation, and transportation
Vera Koniukhova
Vera Koniukhova
Events Manager
Media Partner/s
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