In this meeting, we will discuss about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications including quantum photonics.
Peter O’Brien (Professor) is Head of the Photonics Packaging Group at the Tyndall Institute, University College Cork and Director of the European Photonics Packaging Pilot Line (www.pixapp.eu). He is also Deputy Director of the SFI Centre for Integrated Photonics (IPIC). His research group develops packaging and integration solutions for a range of photonic-based applications including high-speed communications, miniaturised biomedical and diagnostics and remote and autonomous sensing. Prof O’Brien is also a visiting professor at the Optical Science Centre at the University of Arizona. He previously founded and was CEO of a start-up company manufacturing speciality photonic systems for bio-imaging and pharmaceutical product monitoring applications, which he sold in 2009. Prior to this, he was a post-doctoral scholar at the California Institute of Technology in Pasadena, and a research scientist at NASA’s Jet Propulsion Laboratory, where he was involved in the development of submillimetre wave devices for remote (space) sensing applications. He received his degree and PhD in Physics from Trinity College Dublin and University College Cork respectively.
Jeroen Duis (Chief Commercial Officer) received his bachelor’s degree from the Technical University of Rijswijk in 2001. After his study he worked 16 years within TE Connectivity. Within the Fiber Optic Business Unit and corporate technology team he held several positions in engineering, research, technology scouting and management. During this time, he gained a broad experience in: laser processing of glass fibers, WDM multiplexing, low loss optical interconnects, next generation photonic chip packaging for applications in mobile phones, automotive and high speed computing applications. In March 2017 he accepted a position at SMART Photonics, a scale up in Indium Phosphide wafer manufacturing where he was responsible for the business development. November 2018, Jeroen accepted a position as Chief Commercial Officer at PHIX photonics assembly where he is responsible for the commercial activities and the strategic direction for the hybrid packaging. He is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.
Jochen Zimmer has a background in experimental physics, micro- and nanostructure fabrication and 3D printing. He is a Sales Manager at Nanoscribe GmbH & Co. KG since 2017
Nikolaus Flöry, is technical business development manager at vario-optics ag. He is responsible for consulting customers and project partners in developing miniaturized photonic applications & products using photonic integrated circuits. He holds a PhD in Photonics from ETH Zurich.
Received the M.Sc. degree in Electronics and Telecommunications from CICESE Research Center,
Ensenada, Mexico, in 2008. In 2014, he obtained the Ph.D. degree in Optoelectronics and Optical
Communications from The RINCE Institute, Dublin City University, Dublin, Ireland. After his
graduation, he conducted research as postdoctoral research fellow at Chalmers University of
Technology, in Sweden, working on fiber-based phase-sensitive amplifiers. In 2017, he was awarded
a co-funded Marie Skłodowska–Curie fellowship to work on the development of 3D micro-printing of
optical components at Trinity College Dublin in Ireland. After that, he was awarded an industry
fellowship to conduct research on 3D photonic components for telecommunication applications. He
joined ficonTEC in 2019 as a research and development engineer and has contributed to the creation
and growth of ficonTEC Ireland’s applications and R&D laboratory, in Cork, Ireland. He has been
involved in funded and commercial projects with applications in the areas of telecommunications,
sensing and biomedical. His interests are related to the development of new optical packaging
processes and techniques as well as in providing solutions to customers to scale up their products to
high volume manufacturing and testing.
