This is a free event
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In this meeting, we will have an update about new trends and considerations for packaging and testing of large volumes of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics.Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications and development faster and cost-effective automation processes.
Tim holds a Masters in EE and has amassed exceptional breadth and depth of technical expertise encompassing the design of photonic integrated circuits, packaging, electronics, control systems and test.
Cyriel is responsible for Product Management of Rockley’s data communications business. Before joining Rockley in 2015, he was a researcher and research manager at IBM. He holds MS and PhD degrees in Electrical Engineering from TU/e.
Ana’s role at iPPRONICS is to investigate new applications and identify potential partners for the implementation of programmable photonics including relationships with the supply chain. Her expertise lies in the investigation of new applications related mainly to Sensing and Optical comm.