Electronicelectronics
29 June 2023 / 10:00 - 12:00 CEST
EPIC Technology Workshop on PIC Post-Processing & Packaging at the LASER World of PHOTONICS
Munich, Germany

In cooperation with
Hosted by


The importance of photonic integrated circuits (PICs) is growing in a wide range of applications, including communications, optical computing, automotive, aerospace, agriculture and medical. PICs are key enablers to meet the increasing demand for data transfer speed, bandwidth and performance. Our meeting will focus on the latest trends and considerations in the packaging and post-processing of PICs. We will cover a range of topics, including passive and active optical alignment, wafer-level versus die-level packaging and testing, thermal control, cost-effectiveness, volume production versus pricing, and new manufacturing requirements in co-package optics.
Among others, we deepen the discussion about how to ensure optimal performance and minimize development costs. In this case chip polishing, inspection of the polished end surface as well as effective testing of PICs throughout the development cycle are essential:

    • Requirements towards polishing technologies, while demonstrating automated systems featuring custom design holders that can be adjusted to user-specified angles to reduce back-reflection
    • Testing and measurement challenges and technologies to look inside PICs and evaluate the optical performance of the individual integrated components both in lab and production environments
    • Inspection technologies such as video monitoring systems to both observe the polishing process and inspect the quality of the polished surfaces.

Key industry players will join us to discuss the adoption of standards, as well as packaging requirements for emerging applications such as quantum photonics.
Overall, we aim to provide valuable insights into the latest developments in PIC packaging and post-processing. Our meeting will enable attendees to stay up-to-date with the latest industry trends and make informed decisions for their specific applications.

REQUEST FREE EXHIBITON TICKET FOR LASER WORLD OF PHOTONICS HERE

Agenda

10:00 – 10:02 Welcoming words by Ivan Nikitski, Photonics Technology Manager at EPIC – European Photonics Industry Consortium (Europe / France)
10:02 – 10:05 Welcoming words by Anke Odouli, Exhibition Director at Messe Munich (Germany)
10:05 – 10:10 Welcoming by Jan Meise, CEO at AMS Technologies (Germany)

10:10 – 10:25 AMS TechnologiesProcessing Considerations when Polishing PICs and Optical Waveguides – Mario Bacak, Sales Engineer (Germany)
10:25 – 10:40 Luna InnovationsAddressing the Challenges of PIC Testing – Ian Shannan, Vice President of Sales EMEA (United Kingdom)
10:40 – 10:55 PHIXPhotonic Packaging from Prototype to Volume – Jeroen Duis, CCO (the Netherlands)
10:55 – 11:10 ICON PhotonicsScalable Packaging of PIC Exploiting Wafer-level Optical and Electrical Interconnects – Jean-Luc Polleux, Co-founder and CTO (France)
11:10 – 11:25 ficonTEC ServiceChallenges and Strategies for High-Volume Manufacturing and Testing of Co-Packaged Optics – Augusto Mandelli, International Sales, Service and Marketing Director (Germany)
11:25 – 11:40 EtteplanFlexibility and Short Changeover Times in Packaging – Niels Jansen, Engineering Manager (The Netherlands)
11:40 – 11:55 PhotonfirstPIC-based System Development: From Idea to Product – Elvis Wan, Process Development Engineer (The Netherlands)

11:55  – 12:30 Networking break

Venue

LASER World of PHOTONICS – Weltleitmesse und Kongress, Am Messeturm, 81829 München, conference room A21. Map available HERE.

Speakers

Processing Considerations when Polishing PICs and Optical Waveguides

Sales Engineer at AMS Technologies

Addressing the Challenges of PIC Testing

Ian Shannan
Vice President of Sales EMEA at Luna Innovations

Photonic Packaging from Prototype to Volume

CCO at PHIX

Scalable Packaging of PIC Exploiting Wafer-level Optical and Electrical Interconnects

Co-founder and CTO at ICON Photonics

Challenges and Strategies for High-Volume Manufacturing and Testing of Co-Packaged Optics

International Sales, Service and Marketing Director at ficonTEC Service

Flexibility and Short Changeover Times in Packaging

Engineering Manager at Etteplan

PIC-based System Development: From Idea to Product

Process Development Engineer at Photonfirst
Attendees
Sponsor
Supported By
Program Manager
Coordination
Ivan Nikitski, PhD
Ivan Nikitski, PhD
Technology Manager for Quantum and Integrated Photonics
Event Manager
Logistics, venue, accommodation, and transportation
Neringa Noreikiene
Neringa Noreikiene
Events Manager

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