Processing Considerations when Polishing PICs and Optical Waveguides
The importance of photonic integrated circuits (PICs) is growing in a wide range of applications, including communications, optical computing, automotive, aerospace, agriculture and medical. PICs are key enablers to meet the increasing demand for data transfer speed, bandwidth and performance. Our meeting will focus on the latest trends and considerations in the packaging and post-processing of PICs. We will cover a range of topics, including passive and active optical alignment, wafer-level versus die-level packaging and testing, thermal control, cost-effectiveness, volume production versus pricing, and new manufacturing requirements in co-package optics.
Among others, we deepen the discussion about how to ensure optimal performance and minimize development costs. In this case chip polishing, inspection of the polished end surface as well as effective testing of PICs throughout the development cycle are essential:
Key industry players will join us to discuss the adoption of standards, as well as packaging requirements for emerging applications such as quantum photonics.
Overall, we aim to provide valuable insights into the latest developments in PIC packaging and post-processing. Our meeting will enable attendees to stay up-to-date with the latest industry trends and make informed decisions for their specific applications.
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Processing Considerations when Polishing PICs and Optical Waveguides
Addressing the Challenges of PIC Testing
Photonic Packaging from Prototype to Volume
Scalable Packaging of PIC Exploiting Wafer-level Optical and Electrical Interconnects
Challenges and Strategies for High-Volume Manufacturing and Testing of Co-Packaged Optics
Flexibility and Short Changeover Times in Packaging
PIC-based System Development: From Idea to Product