The EPIC Online Technology Meeting on Photonics for the Quantum Industry highlighted how photonic integration is helping quantum technologies move from laboratory demonstrations towards scalable, manufacturable systems. Speakers from across the supply chain discussed the importance of integration, packaging, ruggedization, low-loss connectivity, testing, and collaboration in bringing quantum solutions closer to real-world deployment.
At the EPIC Online Technology Meeting on Photonics for the Quantum Industry, the discussion focused on how photonic integration can help quantum technologies move from laboratory demonstrations towards scalable, manufacturable systems.
Speakers from across the supply chain shared their perspectives, including research institutes, component providers, packaging specialists, and interconnect manufacturers. Below is a short recap of the presentations. You can watch the full two-hour discussion on our YouTube channel, and download the presentations here.
Fraunhofer HHI presented photonic quantum devices and highlighted one of the key challenges in the field: reducing the size, cost, and complexity of quantum systems. The presentation showed how quantum technologies can move from optical benches to integrated platforms, with examples such as European-designed single-photon avalanche diodes, monolithic InP PICs for quantum key distribution, hybrid PICs with micro-optical elements, photon-pair sources, and compact sensing demonstrators. The key message was that both monolithic and hybrid integration will play an important role, depending on the required performance, scalability, and materials.
Fraunhofer IPMS gave an overview of photonic and microelectronic technologies for quantum systems, with a strong focus on sensing and additional activities in quantum computing. The presentation underlined the importance of CMOS-compatible processes, MEMS, microdisplays, and integrated system approaches to make quantum devices easier to manufacture and more relevant for real-world applications.
ficonTEC looked at what it will take to manufacture and scale quantum technologies. The presentation emphasized that quantum systems require complex photonic circuitry, precise assembly, low-loss interconnects, advanced lasers, and reliable testing strategies. A clear conclusion was that quantum technologies will not scale without industrialized packaging, standardization, known-good-die testing, stronger supply chains, and more entrepreneurship to bring these solutions into practical deployment.
PhotonFirst focused on PIC packaging for demanding applications and explained why fragile PICs must be ruggedized before they can be used in real environments. The company shared examples related to fiber-array assembly, qualification standards, process optimization, and applications in harsh environments such as space and downhole sensing.
FEMTOprint presented integrated optical connectivity for glass-based quantum devices, showing how laser processing can be used to create glass ferrules, waveguides, cavities, microstructures, and connectors. The presentation positioned glass as a flexible platform for ion traps, optical routing, and compact quantum assemblies.
GLOphotonics introduced fired gas cells for quantum applications, highlighting their role as enabling components for miniaturized atomic clocks and related systems.
Diamond presented low-loss fiber-optic interconnects, focusing on polarization-maintaining fibers, connector performance, and the importance of reliable interconnection for polarization-sensitive quantum PIC applications.
Overall, the meeting showed that photonics is essential for the future of quantum technologies. At the same time, the path to industrial adoption will depend not only on scientific progress, but also on integration, packaging, ruggedization, low-loss connectivity, testing, supply-chain maturity, and close collaboration across the ecosystem.
