11:20 – 11:25 Welcome and introduction by EPIC

Speaker presentations:

11:25 – 11:40 VLC Photonics – Reliable and Scalable Design and Test of Photonic Components – Iñigo Artundo, CEO (Spain)
11:40 – 11:55 Focuslight Switzerland – Saying “CPO” and Meaning “Co-packaged micro-Optics” – CPO and its Enablers – Wilfried Noell, Chief Scientist (Switzerland)
11:55 – 12:10 vario-optics  – Optical PCBs: Enabling Next-Generation Interconnects for AI and High-Performance Systems – Nikolaus Flöry, CTO (Switzerland)
12:10 – 12:25 Innolume – Quantum Dot Lasers for Next-Generation Optical Interconnects: Scalable Solutions for AI-Driven Datacenters – Alex Borodkin, Staff R&D Engineer (Germany)
12:25 – 12:40 SAES – Strategies for Reducing Gaseous Contaminants in Sealed Optoelectronic Devices – Giovanni Zafarana, Senior Scientist (Italy)
12:40 – 12:55 FEMTOPRINT – Glass Micro-Components for Fiber Connectivity in Co-Packaged Optics & Quantum Photonics – Rolando Ferrini, Chief Product Officer, BD Photonics (Switzerland)
12:55 – 13:10 JENOPTIK Optical Systems – Aligning Optical Wafer Probing with Electrical Test Methods – Needs and Challenges in Silicon Photonics Testing – Tobias Gnausch, Product Manager (Germany)
13:10 – 13:25 Albis Optoelectronics – Evanescently Coupled III–V Photodiodes Integrated on a Silicon Photonics Platform – Maria Hämmerli, Team Lead APD (Switzerland)
13:25 – 13:40 LIGENTEC – High Speed Modulation on Low Loss PICs – Michael Geiselmann, President & CCO (Switzerland)

13:40 – 13:50 Closing words by EPIC

The Product Focus theatre in the ECOC Exhibition Hall

Anna Trachtova, Marketing Manager at EPIC, +420 732 549 615