Laser processes have become essential tools in the semiconductor industry, offering high precision, minimal thermal impact, and flexibility for a wide range of fabrication steps. Ultrafast and short-pulse lasers are increasingly used for applications such as wafer dicing, micro-drilling, patterning, marking, and material ablation, enabling damage-free processing of delicate and multilayered semiconductor materials. Laser annealing and laser lift-off techniques are also widely adopted for enhancing material properties, enabling layer separation, or improving carrier mobility in advanced semiconductor structures. With the growing demand for smaller feature sizes, advanced packaging, and heterogeneous integration, laser-based processes provide the necessary accuracy and throughput while supporting non-contact, contamination-free operations. Innovations in beam shaping, pulse-on-demand technology, and process monitoring are further expanding the capabilities of lasers in semiconductor manufacturing, supporting next-generation chip production and enabling more efficient and scalable device fabrication.

We invite the whole supply chain to discuss about the latest developments on lasers for the semiconductor industry and to understand the challenges and needs to be solved in the future.