Introduction by Jose Pozo, CTO at EPIC

Co-packaged optics pipe dream
Mark Lutkowitz, Principal at fibeReality

Pilot-scale photonic integrated circuit packaging through PIXAPP
Padraic Morrissey, PIXAPP Technology Manager at Tyndall National Institute

The JePPIX photonic integrated circuit manufacturing platform
Kevin Williams, Professor and Chair of the Photonic Integration research group at TUE

Photonics, a key technology for sensing, communicating and beyond
Eric Mounier, Director of Market Research – Fellow at Yole Développement

Low-cost packaging for high performance multi-lambda T/ROSAs
Sven Kruger, VP Product Management & Sales at HUBER + SUHNER Cube Optics

Micro-optics for compact transceiver solutions
Wilfried Noell, Director R&D at SUSS MicroOptics

What we can do more than microlenses?
Myun-Sik Kim, Product Manager Micro-Optics at Axetris

H2020 PASSION project technological solutions enabling multi-Tb/s transmission
Pierpaolo Boffi, Associate Professor at Politecnico di Milano