Laser processes have become essential tools in the semiconductor industry, offering high precision, minimal thermal impact, and flexibility for a wide range of fabrication steps. Ultrafast and short-pulse lasers are increasingly used for applications such as wafer dicing, micro-drilling, patterning, marking, and material ablation, enabling damage-free processing of delicate and multilayered semiconductor materials. Laser annealing and laser lift-off techniques are also widely adopted for enhancing material properties, enabling layer separation, or improving carrier mobility in advanced semiconductor structures. With the growing demand for smaller feature sizes, advanced packaging, and heterogeneous integration, laser-based processes provide the necessary accuracy and throughput while supporting non-contact, contamination-free operations. Innovations in beam shaping, pulse-on-demand technology, and process monitoring are further expanding the capabilities of lasers in semiconductor manufacturing, supporting next-generation chip production and enabling more efficient and scalable device fabrication.
We invite the whole supply chain to discuss about the latest developments on lasers for the semiconductor industry and to understand the challenges and needs to be solved in the future.
Natan Kaplan, M.Sc. in Applied Physics from TAU, is the CTO of Holo/Or with over 12 years of experience specializing in diffractive components for high precision laser systems.
After postdocs in France and Germany, she co-founded RayVen Lasers GmbH in 2025 and she serves as CEO.
Maurice Clair studied Mechanical Engineering at the University of Technology Chemnitz (Germany). He joined 3D-Micromac in 2005 as a development engineer and is now team leader of the technology and innovation management department.
Michał Ćwikła is a laser microprocessing specialist at the Fluence Technology Application Laboratory, joining the company in 2025. He specializes in developing laser processing techniques, designing optical systems, and conducting internal R&D projects. He completed his PhD at the Faculty of Mechanical Engineering at Wrocław University of Science and Technology, focusing on liquid-assisted laser processing. He is the author of eight publications in the fields of laser processing and the design of optical systems for process monitoring.
Robert Kirchner (Co-Founder & CEO) develops multi-material 3D printing since 2018. He has an engineering degree from Technische Universität Dresden and has 10+ years of experience in 3D micro-nano-fabrication. Robert drives the vision, the strategic development, and supports the system design. He has a background in electrical engineering and received his PhD in polymer microsystems fabrication in 2011. During his PhD, and especially afterwards in his professional positions, such as at the Fraunhofer Institute for Photonic Microsystems (IPMS) and the Paul Scherrer Institute, he did intensive research in the fields of nanoimprint lithography, grayscale lithography, and 3D printing using 2-photon absorption-based laser writing.
