For more information about the show, please follow ECOC Exhibition.
This is a priced event
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EPIC invites you to a two-hour trip through the whole photonics supply chain of Optical Communications. This includes component design, fabrication, packaging and test, and their deployment in current and future optical networks. This event will be EPIC style, with the energy of Jose Pozo as moderator and with the purpose of all participants, not only speakers, to answer the so called EPIC question: what can you do for the others/what can the others do for you?
Introduction by Jose Pozo, CTO at EPIC
Co-packaged optics pipe dream
Mark Lutkowitz, Principal at fibeReality
Pilot-scale photonic integrated circuit packaging through PIXAPP
Padraic Morrissey, PIXAPP Technology Manager at Tyndall National Institute
The JePPIX photonic integrated circuit manufacturing platform
Kevin Williams, Professor and Chair of the Photonic Integration research group at TUE
Photonics, a key technology for sensing, communicating and beyond
Eric Mounier, Director of Market Research – Fellow at Yole Développement
Low-cost packaging for high performance multi-lambda T/ROSAs
Sven Kruger, VP Product Management & Sales at HUBER + SUHNER Cube Optics
Micro-optics for compact transceiver solutions
Wilfried Noell, Director R&D at SUSS MicroOptics
What we can do more than microlenses?
Myun-Sik Kim, Product Manager Micro-Optics at Axetris
H2020 PASSION project technological solutions enabling multi-Tb/s transmission
Pierpaolo Boffi, Associate Professor at Politecnico di Milano
For more information about the show, please follow ECOC Exhibition.