Co-packaging silicon and photonic elements will provide the most efficient way to handle the needs of high-speed silicon I/O. In this meeting, we will review the last developments on co-packaged optics identifying collaborations and user requirements.
This website uses cookies so that we can give you the best user experience possible. Cookie information is stored in your browser and performs functions such as recognizing you when you return to our website and helping our team understand which sections of the website you find most interesting and useful.
For more information, visit our privacy policy page