10:30 – 10:45 Welcome and introduction by EPIC
10:45 – 11:00 Advanced Photonics Integrated Packaging Solutions Enabling the Next Generation Optical Connectivity – Carlos Viana, CEO at ICON Photonics
11:00 – 11:15 Photonics Packaging in Datacenter Focused Applications – Giorgio Cazzaniga, Director of Product Management by Jabil
11:15 – 11:30 Advanced Material Solutions for Packaged Optoelectronic Devices – Luca Mauri, Head of the Getters & Dispensers Development Laboratory at SAES Group
11:30 – 11:45 PHABULOuS – Fabrication Technologies for Free-form Optics – Ton Offermans, Technical Coordinator at PHABULOuS Pilot Line / CSEM
11:45 – 12:00 JePPIX: Scaling up InP PIC Production – Kevin Williams, Professor and Chair of the Photonic Integration research group at TU Eindhoven / JePPIX
12:00 – 12:15 PDKs of the Future: Enabling a Modular Design Ecosystem – Pierre Wahl, Co-founder & Global Sales Director at Luceda Photonics
12:15 – 12:30 Photonic Integration Based Devices for Tunable and Next Generation Networks Speaker – Francisco Rodrigues, CEO at PICadvanced
12:30 – 13:00 Networking
Location: The Product Focus theatre, Hall 1, Messe Basel