Moderators: Carlos Lee, Director General at EPIC – European Photonics Industry Consortium (Belgium/Europe) & Daisy He,  Operation Director at SpectraLine Photonics Technologies  (China)

10:00 – 10:05 Welcoming by the moderators

10:05 – 10:20 Latest Red Laser Diode Advances Biomedical and Quantum Technology – Yangjun Chen, Deputy Manager at USHIO SHANGHAI
10:20 – 10:35 Smart VCSEL Technology: Added Value by Integrating Advanced Optical Structures – Kevin Lu, Senior Sales and Marketing Manager – APAC at TRUMPF Photonic Components
10:35 – 10:50 SCHOTT High Precision Glass Enables Optical Component and Equipment Innovation – Mark Jiang, China Sales Manager for Aerospace, Aviation & Semiconductor at SCHOTT
10:50 – 11:05 Ultra–Low Surface Roughness Polishing and Metrology – Bence Cai, Account Manager for South China  at Edmund Optics
11:05 – 11:20 New High Heat Thermoplastic Resins for Sensor Lenses & On-Board Optical Packaging – David L. Wang, Senior Product Manager, High Heat Resin at SABIC
11:20 – 11:35  High Performance Functional Adhesives to Stimulate Photonics Industry  – Tommy Zhang, Regional Sales Manager South China / Regional Business Development Manager Camera | B. Eng. at DELO
11:35 – 11:50  [EN] Seamless PIC Testing Capability: Moving from Lab to Production – François Couny, Senior Product Line Manager at EXFO
11:50 – 12:05 Aligned Two-Photon Lithography and Its Applications in Photonics Packaging – Wanyin Cui, General Manager at Nanoscribe China
12:05 – 12:20 Next Generation Photonic Integration and Packaging Solutions with Photonic Wire Bonding (PWB) and Facet-Attached Micro-Optical Elements – Zewang You, Material and Process Lead at Vanguard Automation

Closing remarks by the moderators

Shenzhen World Exhibition & Convention Center (address: No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, Guangdong, China), the open space inside the exhibition hall 5.

For more information about the venue and how to reach it, please read HERE.