27-28 October 2027
EPIC Technology Meeting on Industrial Laser Processes at TRUMPF
Ditzingen, Germany
Hosted by
Supported By
EPIC Members
464.10€ incl. VAT
Invited companies
464.10€ incl. VAT
Non-members
702.10€ incl. VAT


Please register only one person per company for the best possible networking. You may contact us for special enquiries.

Industrial laser processing has evolved from a niche manufacturing technology into one of the key enabling pillars of modern advanced manufacturing. Over the past decades, continuous improvements in laser sources, beam delivery systems, optics, motion control, and process monitoring have transformed laser-based processes from specialized solutions into highly reliable, high-throughput industrial tools. Today, lasers are routinely employed for cutting, welding, drilling, marking, surface engineering, additive manufacturing, and micromachining across sectors ranging from automotive and aerospace to electronics, medical devices, and energy. More recently, the convergence of high-brightness laser sources, dynamic beam shaping, ultrafast processing, artificial intelligence, and digital manufacturing has accelerated this evolution, enabling unprecedented levels of precision, flexibility, productivity, and process control.

This meeting will provide a comprehensive overview of the latest developments in industrial laser processing technologies, highlighting recent advances in laser sources, beam shaping, ultrafast processing, process monitoring, automation, and AI-assisted manufacturing. Particular attention will be given to emerging applications across key industrial sectors, including e-mobility and battery manufacturing, semiconductors and advanced packaging, aerospace or data-center infrastructure. By bringing together companies from the whole supply chain, the meeting aims to foster knowledge exchange and identify future opportunities for industrial laser technologies.

Agenda

OPTIONAL

26 October 2027, Tuesday

10:00 – 18:00 Company visits – TBC
19:00 – 22:00 Pre-event networking reception and dinner – location TBC
Provisional schedule, in preparation.

MAIN AGENDA

27 October 2027, Wednesday

12:45 – 13:30 Registration and networking lunch

13:30 – 15:30 SESSION 1

The agenda is currently being prepared. If you are interested in participating, please contact us.

15:30 – 16:15 Networking coffee break

16:15 – 17:45 SESSION 2

18:00 End of day 1 & bus transfer to dinner location

Provisional schedule, in preparation.

28 October 2027, Thursday

08:15 – 09:00 Welcoming coffee

09:00 – 10:30 SESSION 3

The agenda is currently being prepared. If you are interested in participating, please contact us.

10:30 – 11:15 Networking coffee break

11:15 – 12:45 SESSION 4

12:45 – 13:45 Networking lunch and end of the technology meeting
14:00 – 15:00 Company visits (TBC)

Provisional schedule, in preparation. Agenda in preparation, companies interested in participating, contact us.

Venue

TRUMPF Laser- und Systemtechnik (address: Johann-Maus-Strasse 2, 71254 Ditzingen, Germany)

Accommodation

TBA.

Technology Advisory Committee
Individual / Professional
Head Of Business Development at SCANLAB
Subject Specialist Laser Beam Processes for Car Body Construction and Electromobility at Audi
R&D Director of Laser Microprocessing at Fluence
Head of Technology and Innovation Services at 3D-Micromac
Contact Information
Technology Manager
Technology scope and agenda
Antonio Castelo, PhD
Antonio Castelo, PhD
Technology Expert for Bio-Medical and Lasers
Programme Manager
Coordination
Lídia Briquets
Lídia Briquets
Programme Manager
Event Manager
Logistics, venue, accommodation, and transportation
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