Laser Microprocessing Conquers the Challenge of Ultrafine Components
Laser microprocessing covers a broad scope of laser processes used in the machining of ultrafine structures. In this area of technology, micrometer scale levels of precision and accuracy are required to obtain the desired structures and, more critically, ensure the functionality of produced parts like ultrafine components. The rise in the number of markets and applications for these processes in recent years corresponds to the increasingly demanding requirements from end users, in terms of throughput as well as precision. To meet necessary thresholds, industry players are spearheading developments to laser sources and the additional components that complete the modern workstation. Ultrashort-pulse lasers, high-performance operability at MIR wavelengths, scanners, robots and movement stages, software, and integration capabilities are among the active areas of innovation. At the same time, process monitoring is reaching new levels of functionality, providing a means to control the laser process in-line and ensure the quality of the produced parts.The semiconductor and consumer electronics industries are two prominent adopters of Laser Microprocessing. These sectors benefit from the advantages that industrial lasers provide for various processes in the manufacture and refinement of wafers, displays, circuit boards, and other ultrafine components. The architectures of electronic components, in particular, consist of multiple layers, each potentially made of very different materials. Additionally, cleanliness must be ensured throughout the manufacturing process. Antonio Castelo explores the factors that compound the challenges faced by laser systems tasked with enabling such precision processing. And highlights companies that excel in this challenge like Litilit, Synova SA, Femtum, Center for Physical Sciences and Technology (FTMC), Akoneer, Precitec – Laser Material Processing, New Imaging Technologies (NIT) and PULSATE.
Read the full article published in Photonics Spectra July 2024 Issue.
