3 March 2021 / 15:00 - 17:00
EPIC Online Technology Meeting on Roadmap 2021 for Co-packaged Optics (in cooperation with COBO & EA)
Online Event

In cooperation with

Co-packaging optics have the potential to reduce the length of the switch-optic interconnects lowering the power consumption of the switch-optic electrical I/O which will be key to support greater networking demands. The requirements for co-packaged optic assemblies for network switch applications will be discussed in this meeting, with special focus on the elaboration of a roadmap for co-packaged optics and collaborations between the supply chain to achieve the requirements for volume manufacturing of these devices.

Spirit of the meetings

During these online technology meetings, we are looking for the challenges the industry is facing and bringing together the entire supply chain to address these challenges. Bringing together end-users with component suppliers and system integrators that will answer the EPIC question “What can you do for them and what can they do for you” creates the perfect foundation to establish new business relationships and find ways for new collaborations and partnerships.


Was at Source Photonics from 2004 to 2015. Thomas was with Agility Communications from 2000 to 2004. Holds a Ph.D. degree in Electrical Engineering from the University of California, Santa Barbara, and an M.S. from Technical University of Denmark.

General Manager, Photonic Integration; Silicon Photonics Products Division at Intel Corporation

Mark is currently Principal Engineer at Microsoft (Azure Hardware Architecture) focused on next-generation data center network architectures and optical interconnect technologies.

Principal Optical Network Architect at Microsoft

Ruby has held multiple technical and managerial positions in the optics industry with over 15 years of experience. She is now focusing on next-generation datacenter optics and network switch ASIC technologies.

Sourcing Manager, Next Generation Optics at Facebook

Prior to Sicoya Sven was the Global BD of Optoelectronics at FCI. Before joining FCI he was Global VP of Engineering at MergeOptics, Senior IC Design Engineer at Multilink Technologies and Senior System Architect at Santel Networks in Fremont, USA.

CEO at Sicoya

He has been in the Optical Systems & Semiconductor developments for ~30 years. Prior to Ranovus, he held Executive and Technical positions in various companies such as Inphi, Cortina Systems, Cisco & Nortel.

SVP of Business Development at Ranovus

Prior to joining Broadcom, he lead the development of SiPh based Data Communications systems at Rockley Photonics and the commercialization Intel’s SiPh based Transceiver products.

Director of R&D at Broadcom

Benjamin is a manager in the Advanced Technology group of ADVA working in the field of photonic integration. His focus is mostly on coherent transceivers and related assembly and packaging issues.

Manager of Advanced Technology at ADVA
Promo Video
Dr. Jose Pozo
Dr. Jose Pozo
Director of Technology and Innovation
Media Partner/s
Market Reports 33, 36
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