As data rates continue to increase, optical interposers are emerging as a key technology to overcome the limitations of electrical interconnects in advanced computing and communication systems. This meeting will explore developments in photonic integration platforms, optical packaging, chip-to-chip interconnects, coupling technologies, and manufacturing solutions. Component suppliers, semiconductor manufacturers, system architects, and equipment providers are invited to exchange requirements and technological roadmaps. The objective is to accelerate the deployment of optical interconnect technologies for next-generation computing.